Electronics: Printed Circuits, Connectors, and Semiconductors

Surface Activation

Specialty materials for surface activation of dielectric substrates such as polyimide, Teflon, and epoxy, used as preparation for electroless copper and electroless nickel plating

Materials designed for surface preparation of copper prior to photoresist lamination, inner layer lamination, and final finishes

Photoresist developer, photoresist remover, solder mask stripper

Cleaning agents for resist developing and stripping equipment

Strippers for tin-lead coatings from copper, for gold removal from nickel, and for electroless nickel removal from copper

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Metallization Processes

Zero stress cold electroless copper for SAP (Semi-Additive Process)

Hot electroless copper

High-build electroless copper for MID (Molded Interconnect Devices)

Medium-phosphorus electroless nickel, RoHS-compliant, lead- and cadmium-free, operating at low temperature (55°C), suitable for MID applications

Bright electrolytic copper DC

Bright electrolytic copper PPR

Matte electrolytic copper DC

DC copper designed for simultaneous plating and blind via filling

PPR copper specifically for via filling

Direct metallization based on conductive polymer and graphite

Matte electrolytic tin plating based on MSA, suitable for barrel and reel-to-reel processes

Special electrolytic nickel plating for barrel applications and prevention of tin discoloration

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Final Finishes

Immersion silver

Immersion tin

OSP (Organic Solderability Preservative)

ENIG (Electroless Nickel Immersion Gold)

ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

Matte electrolytic tin or tin-lead

Fluxes and oils designed for HASL processes

Electrolytic sulfamate nickel plus 99.99% pure soft gold

Hard gold using Au-Co or Au-Ni alloy systems

Electrolytic indium

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Raw Materials from RESONAC

Epoxy and polyimide laminates (CCL) featuring high Tg, low Dk, low Df, low CTE, with various prepregs available

Ultra-thin laminates designed for fine-line patterning in mSAP and SAP processes

High-resolution photoresists capable of achieving up to 6/6 micron resolution